On March 10, BOE held mass production delivery ceremony at Zhuhai. Customers all over China and from the United States, Europe, Japan, South Korea, Southeast Asia, and other regions gathered for the event. This moment marks a significant milestone for BOE in the field of MLED display technology. By integrating LED chip resources, COB packaging, and MLED applications, BOE has established an industry-leading “chip-packaging-display” manufacturing capability. This layout not only accelerates the collaborative innovation and global expansion of the MLED industry but also propels BOE toward the leader in the COB industry. WANG Xiping, Vice Chairman of the Executive Committee of BOE Technology Group, stated that BOE has always adhered to an innovation-driven development approach. The MLED business is one of BOE’s high-potential tracks within its “1+4+N” strategy. BOE look