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BOE MWC 2024

BOE Empowers Global Partners at MWC 2024

BOE (BOE Technology Group) made a strong showing at the world-renowned Mobile World Congress (MWC2024) in Barcelona, Spain, partnering with several top global brands to showcase innovative consumer electronics products. These smartphones, tablets, laptops, and monitors all featured BOE’s latest display technologies. As a global leader in IoT innovation, BOE remains dedicated to empowering various applications with its advanced display technology.  Flexible Displays At MWC 2024, BOE joined forces with Honor, Nubia, and other major brands to unveil several cutting-edge

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BOE Displays Enabling IoT

BOE Chairman Chen Yanshun Receives the 2024 David Sarnoff Industry Achievement Award

BOE Technology Group Chairman Chen Yanshun has been awarded the prestigious 2024 David Sarnoff Industry Achievement Award by the Society for Information Display (SID). The award recognizes Chen’s visionary leadership and innovation in the semiconductor display industry, particularly his pioneering work on the “Displays Enabling IoT” strategy. The David Sarnoff Industry Achievement Award is the highest honor bestowed by SID, and is given annually to an individual who has made significant contributions to the global display industry. The award is

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BOE COB MLED LED

The Rise of COB Technology in LED Displays

In the ever-evolving world of display technology, the COB (Chip on Board) technology has been quietly shaping the future of direct-view LED displays since its inception in 2012.  What is COB technology? COB technology is a leap toward perfection. By directly bonding RGB chips onto a PCB (Printed Circuit Board) and encapsulating them with a protective layer, COB technology offers a robust solution that shields delicate LED chips from external damage. This ingenious approach not only enhances durability but also

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BOE ISE 2024

BOE at ISE 2024: Pioneering the New Era of IoT and Display Technology

On January 30, ISE 2024 grandly opened in Barcelona, Spain, marking the 20th anniversary of the ISE exhibition. BOE (Booth #3T150 & #3U150) showcased a range of innovative products and technologies for digital signage, MLED, Glasses-Free 3D and medical applications. BOE also presented IoT solutions for office, transportation, and healthcare scenarios. These offerings comprehensively demonstrated BOE’s technology leadership in empowering a myriad of use cases. BOE prominently featured its COB and COG MLED technologies. Here is the 162-inch MLED COB

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BOE In-cell Touch NFC integration

BOE Integrates In-cell Touch and NFC with TDDI Technology

BOE announces the integrated solution of NFC and In-cell touch LCD. This solution integrates the NFC coil inside the LCD screen, enabling card-swiping on a touchscreen without additional components. It provides greatly enhanced user experience with specially designed TDDI technology combining display, touch, and NFC functions. The solution uses a grid design to integrate the NFC coil on the TFT substrate, eliminating the need for additional mask layers. Metals with higher electrical conductivity are selected to reduce coil impedance, improving

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